Optimization of thermionic cooling semiconductor heterostructures with deep learning techniques

  1. Fernandez, J.G.
  2. Etesse, G.
  3. Comesana, E.
  4. Seoane, N.
  5. Zhu, X.
  6. Hirakawa, K.
  7. Garcia-Loureiro, A.
  8. Bescond, M.
Konferenzberichte:
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD

ISBN: 9784863488038

Datum der Publikation: 2023

2023 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2023

Seiten: 281-284

Art: Konferenz-Beitrag

DOI: 10.23919/SISPAD57422.2023.10319607 GOOGLE SCHOLAR
Datenquelle: Scopus